PCB Matrix Launches V7.01 IPC-7351 Land Pattern Calculator
WEBThe free V7.01 IPC-7351 Land Pattern Calculator is said to generate results that match the LP Viewer library documentation. Component families that have been added: aluminum electrolytic capacitors; 2-pin crystals, and land grid arrays. Is a scaled-down version of the LP Wizard. Calculates CAD library parts that comply with the latest IPC-7351 ...
All Circuits Expects Expanded Plant to Be Largest in France in 2 Years
WEBJul 1, 2022 · MEUNG-SUR-LOIRE, FRANCE -- All Circuits this week inaugurated its new electronics manufacturing factory here, where it intends to supplier electronic assemblies to the automotive sector. The company will eventually install 13 SMT lines, reportedly making it the highest-volume EMS site in France.
Understanding 3D AOI, What It Is, and What It Isn’t - Circuits …
WEBDec 1, 2013 · Figure 5. The same part in 3D. Currently, AOI systems come with different levels of 3D coverage for components and solder joints. All 3D systems still offer 2D lighting and 2D inspection. It is for the AOI programmer or the QA department to decide to what extent they’d like to deploy new technology for quality assurance.
Clarifying Through-Hole Fill Levels - Circuits Assembly
WEBOct 22, 2019 · At present, through-hole joint fill requirements and inspection criteria are commonly identified and understood within the J-STD-001/IPC-A-610 specifications. Those indicate Class II/III assemblies should have at least 75% fill, based on the through-hole depth. An oblique angle view x-ray clearly shows the nature and depth of the fill ...
WEBThis amount was applied in the tin/lead experiment. For a no-clean, alcohol flux of 1.5 percent solids, the amount to apply on the test board is: Area board = 100 * 160 mm2 = 24.8 in2. Amount of (wet) flux per board = solid content flux * area * required amount dry flux = 100/1.5 * 24.8 * 0.0016 = 2.645 g.
Sn-Bi Low-Temperature Homogeneous Solder Joint Microstructure ...
WEBJan 21, 2020 · How do LTS solders perform under thermal cycling and drop-shock testing? Several environmental, technology and reliability factors have recently combined to renew interest in the use of tin-bismuth-based solder alloys for motherboard manufacturing.
Tackling Head-in-Pillow Defects with Vapor Phase Reflow - Circuits …
WEBHead-in-pillow (HiP) defects are one of the most common issues that affect printed circuit boards containing ball grid array/land grid array (BGA/LGA) packages. These defects can result in costly repairs and reduce a component’s lifespan. HiP defects are compromised solder joints often attributed to undesired environmental factors during the reflow process.
Circuits Assembly Online Magazine - Home
WEBWürth Elektronik's WR-SMA PCB Solderless connector allows for quick and easy assembly without damage to the PCB. Sawa Releases SC-SA1 Stencil Cleaner. Sawa's SC-SA1 pneumatic air-driven fully automatic stencil cleaner is designed to enhance the efficiency and safety of cleaning processes for SMT stencils, prin...
TRI Releases TR7700QE-S 3-D AOI - Circuits Assembly
WEBMar 19, 2020 · TRI Releases TR7700QE-S 3-D AOI. Published: 19 March 2020. TR7700QE-S 3-D AOI inspects and detects defects in wire bonds, die bonds, SMD, bumps, wafer IC/chip, underfill, and solder joints. Metrology capabilities provide high accuracy and repeatability. Has 5.5µm high-resolution 12MP imaging technology.
Fundamentals and Benefits of Vapor Phase Reflow Soldering
WEBMay 16, 2018 · For some types of assemblies, vapor phase does a better job. It’s fast; no inert atmosphere is required, and there is no possibility of overheating the assembly. There are downsides too, and the appropriate reflow technology is based on each particular assembly. Let’s look at both vapor phase condensation heating and …
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